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Airgap (microelectronics) : ウィキペディア英語版 | Airgap (microelectronics)
Airgap is an invention in microelectronic fabrication by IBM. == Description == By insulating copper wires within a chip with vacuum holes, capacitance can be minimized enabling chips to work faster or draw less power. A vacuum is believed to be the ultimate insulator for what is known as wiring capacitance, which occurs when two adjacent wires on a chip draw electrical energy from one another, generating undesirable heat and slowing the speed at which data can move through a chip. IBM estimates that this technology alone can lead to 35% higher speeds in current flow or 15% lower power consumption.
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